يشترى B39921B3407U410 مع BYCHPS
شراء مع ضمان
B39921B3407U410
- رقم القطعة:
- B39921B3407U410
- الصانع:
- Epcos / RF360
- وصف:
- CERAMIC WIDEBAND FRONTENDFILTER
- حالة الرصاص الحرة / بنفايات الحالة:
- الرصاص الحرة / بنفايات المتوافقة
- الكمية المتوفرة:
- 18310 Pieces
- ورقة البيانات:
- B39921B3407U410.pdf
المقدمة
BYCHIPS هو الموزع تخزين ل B39921B3407U410 ، لدينا مخزون للشحن الفوري وتتوفر أيضا لتوريد وقت طويل. يرجى ان ترسل الينا خطة الشراء الخاصة بك B39921B3407U410 عن طريق البريد الإلكتروني ، وسنقدم لك أفضل الأسعار وفقا للخطة الخاصة بك.
مواصفات
| سلسلة: | * |
|---|---|
| اسماء اخرى: | B3407 |
| مستوى حساسية الرطوبة (مسل): | 1 (Unlimited) |
| الصانع المهلة القياسية: | 14 Weeks |
| الصانع الجزء رقم: | B39921B3407U410 |
| وصف: | CERAMIC WIDEBAND FRONTENDFILTER |
| Email: | [email protected] |
قطع الغيار ذات الصلة لB39921B3407U410
| صورة | رقم القطعة | مصنعين | وصف | رأي |
|---|---|---|---|---|
 |
B39921B3300H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 916MHZ SMD | تحقيق |
 |
B39921B3588U410W9 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 915MHZ REMOTE SMD | تحقيق |
|
B39921B3726U410 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 915MHZ REMOTE SMD | تحقيق |
 |
B39921B3705Z810W3 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 914.7MHZ WIRELESS SMD | تحقيق |
|
B39921B3728U410 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 915MHZ REMOTE SMD | تحقيق |
|
B39921B3718U410 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 916MHZ SMD | تحقيق |
 |
B39921B4301F210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 915.00MHZ SMD | تحقيق |
|
B39921B3949H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | DCC6E Q 3.0X3.0 FILTER | تحقيق |
|
B39921B3945H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | DCC6E Q 3.0X3.0 FILTER | تحقيق |
Latest الأخبار
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers