يشترى ACCESSORIES-PLASTIC COVER 2.1 مع BYCHPS
شراء مع ضمان
ACCESSORIES-PLASTIC COVER 2.1
- رقم القطعة:
- ACCESSORIES-PLASTIC COVER 2.1
- الصانع:
- Schaffner EMC, Inc.
- وصف:
- COVER TERM PLAS FN3359 150/180A
- حالة الرصاص الحرة / بنفايات الحالة:
- الرصاص الحرة / بنفايات المتوافقة
- الكمية المتوفرة:
- 12055 Pieces
- ورقة البيانات:
- ACCESSORIES-PLASTIC COVER 2.1.pdf
المقدمة
BYCHIPS هو الموزع تخزين ل ACCESSORIES-PLASTIC COVER 2.1 ، لدينا مخزون للشحن الفوري وتتوفر أيضا لتوريد وقت طويل. يرجى ان ترسل الينا خطة الشراء الخاصة بك ACCESSORIES-PLASTIC COVER 2.1 عن طريق البريد الإلكتروني ، وسنقدم لك أفضل الأسعار وفقا للخطة الخاصة بك.
مواصفات
| سلسلة: | - |
|---|---|
| اسماء اخرى: | 1151-050 801917 817-1768 ACCESSORIES-PLASTIC COVER 2.1-ND ACCESSORIES-PLASTICCOVER2.1 ACCESSORIES-PLASTICCOVER2.1-ND ACCESSORIESPLASTICCOVER21 |
| مستوى حساسية الرطوبة (مسل): | 1 (Unlimited) |
| الصانع المهلة القياسية: | 10 Weeks |
| الصانع الجزء رقم: | ACCESSORIES-PLASTIC COVER 2.1 |
| للاستخدام مع / المنتجات ذات الصلة: | FN3359 Series |
| وصف: | COVER TERM PLAS FN3359 150/180A |
| الإكسسوارات نوع: | Cover |
| Email: | [email protected] |
قطع الغيار ذات الصلة لACCESSORIES-PLASTIC COVER 2.1
| صورة | رقم القطعة | مصنعين | وصف | رأي |
|---|---|---|---|---|
 |
ACCESSORIES-PLASTIC COVER 2.5 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 800/1000A | تحقيق |
 |
ACCESSORIES-PLASTIC COVER 2.3 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 320/400A | تحقيق |
 |
ACCESSORIES-PLASTIC COVER 2.4 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 600A | تحقيق |
 |
ACCESSORIES-PLASTIC COVER 1.3 | Schaffner EMC Inc. | COVER TERM PLAS FN3270 800/1000A | تحقيق |
 |
ACCESSORIES-PLASTIC COVER 1.1 | Schaffner EMC Inc. | COVER TERM PLAS FN3270 150-600A | تحقيق |
 |
ACCESSORIES-PLASTIC COVER 2.2 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 250A | تحقيق |
Latest الأخبار
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers