يشترى 2A1908-6 مع BYCHPS
شراء مع ضمان
2A1908-6
- رقم القطعة:
- 2A1908-6
- الصانع:
- Bussmann (Eaton)
- وصف:
- KIT NEUTRAL 800A BONDED
- حالة الرصاص الحرة / بنفايات الحالة:
- الرصاص الحرة / بنفايات المتوافقة
- الكمية المتوفرة:
- 18289 Pieces
- ورقة البيانات:
- 2A1908-6.pdf
المقدمة
BYCHIPS هو الموزع تخزين ل 2A1908-6 ، لدينا مخزون للشحن الفوري وتتوفر أيضا لتوريد وقت طويل. يرجى ان ترسل الينا خطة الشراء الخاصة بك 2A1908-6 عن طريق البريد الإلكتروني ، وسنقدم لك أفضل الأسعار وفقا للخطة الخاصة بك.
مواصفات
| سلسلة: | * |
|---|---|
| مستوى حساسية الرطوبة (مسل): | 1 (Unlimited) |
| الصانع المهلة القياسية: | 5 Weeks |
| الصانع الجزء رقم: | 2A1908-6 |
| وصف: | KIT NEUTRAL 800A BONDED |
| Email: | [email protected] |
قطع الغيار ذات الصلة ل2A1908-6
| صورة | رقم القطعة | مصنعين | وصف | رأي |
|---|---|---|---|---|
 |
2A1906-3 | Eaton | KIT BRANCH ENCLOSURE 42 | تحقيق |
|
2A1908-4 | Eaton | KIT NEUTRAL 400A BONDED | تحقيق |
|
2A1909-28 | Eaton | KIT MAIN SUB-FEED LUG 1P2W 225-4 | تحقيق |
|
2A1909-4 | Eaton | KIT MAIN DISCONNECT 70-200A | تحقيق |
|
2A1909-12 | Eaton | KIT MAIN CP LUG 1P3W 30-60A | تحقيق |
|
2A1909-13 | Eaton | KIT MAIN MECHANICAL LUG 1P3W 30- | تحقيق |
|
2A1909-5 | Eaton | KIT MAIN CP LUG 1P3W 70-200A | تحقيق |
|
2A1908-1 | Eaton | KIT NEUTRAL 200A UNBONDED | تحقيق |
|
2A1909-24 | Eaton | KIT MAIN MECHANICAL LUG 1P3W 225 | تحقيق |
|
2A1908-2 | Eaton | KIT NEUTRAL 400A UNBONDED | تحقيق |
|
2A1908-5 | Eaton | KIT NEUTRAL 800A UNBONDED | تحقيق |
|
2A1909-15 | Eaton | KIT MAIN MECHANICAL LUG 1P2W 70- | تحقيق |
|
2A1909-20 | Eaton | KIT MAIN CP LUG 3 PHASE 225-400A | تحقيق |
|
2A1909-3 | Eaton | KIT MAIN SUB-FEED LUG 3 PHASE 30 | تحقيق |
|
2A1908-3 | Eaton | KIT NEUTRAL 200A BONDED | تحقيق |
|
2A1909-8 | Eaton | KIT MAIN DISCONNECT 30-60A 1P3W | تحقيق |
|
2A1906-1 | Eaton | KIT BRANCH ENCLOSURE 18 | تحقيق |
|
2A1907-1 | Eaton | KIT GROUND NON-ISOLATED | تحقيق |
Latest الأخبار
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers